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Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique

Diamond/Cu composites are widely studied as a new generation of thermal management materials in the field of electronic packaging and heat sink materials. The surface modification of diamond can improve interfacial bonding between the diamond and Cu matrix. The Ti-coated diamond/Cu composites are pr...

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Autores principales: Li, Yaqiang, Zhou, Hongyu, Wu, Chunjing, Yin, Zheng, Liu, Chang, Liu, Junyou, Shi, Zhongliang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10005683/
https://www.ncbi.nlm.nih.gov/pubmed/36903755
http://dx.doi.org/10.3390/nano13050878
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author Li, Yaqiang
Zhou, Hongyu
Wu, Chunjing
Yin, Zheng
Liu, Chang
Liu, Junyou
Shi, Zhongliang
author_facet Li, Yaqiang
Zhou, Hongyu
Wu, Chunjing
Yin, Zheng
Liu, Chang
Liu, Junyou
Shi, Zhongliang
author_sort Li, Yaqiang
collection PubMed
description Diamond/Cu composites are widely studied as a new generation of thermal management materials in the field of electronic packaging and heat sink materials. The surface modification of diamond can improve interfacial bonding between the diamond and Cu matrix. The Ti-coated diamond/Cu composites are prepared via an independently developed liquid-solid separation (LSS) technology. It is worth noting that there are obvious differences for the surface roughness between the diamond-{100} and -{111} face by AFM analysis, which may be related to the surface energy of different facets. In this work, the formation of titanium carbide (TiC) phase makes up the chemical incompatibility between the diamond and copper, and the thermal conductivities of 40 vol.% Ti-coated diamond/Cu composites can be improved to reach 457.22 W·m(−1)·K(−1). The results estimated by the differential effective medium (DEM) model illustrate that the thermal conductivity for 40 vol.% Ti-coated diamond/Cu composites show a dramatic decline with increasing TiC layer thickness, giving a critical value of ~260 nm.
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spelling pubmed-100056832023-03-11 Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique Li, Yaqiang Zhou, Hongyu Wu, Chunjing Yin, Zheng Liu, Chang Liu, Junyou Shi, Zhongliang Nanomaterials (Basel) Article Diamond/Cu composites are widely studied as a new generation of thermal management materials in the field of electronic packaging and heat sink materials. The surface modification of diamond can improve interfacial bonding between the diamond and Cu matrix. The Ti-coated diamond/Cu composites are prepared via an independently developed liquid-solid separation (LSS) technology. It is worth noting that there are obvious differences for the surface roughness between the diamond-{100} and -{111} face by AFM analysis, which may be related to the surface energy of different facets. In this work, the formation of titanium carbide (TiC) phase makes up the chemical incompatibility between the diamond and copper, and the thermal conductivities of 40 vol.% Ti-coated diamond/Cu composites can be improved to reach 457.22 W·m(−1)·K(−1). The results estimated by the differential effective medium (DEM) model illustrate that the thermal conductivity for 40 vol.% Ti-coated diamond/Cu composites show a dramatic decline with increasing TiC layer thickness, giving a critical value of ~260 nm. MDPI 2023-02-26 /pmc/articles/PMC10005683/ /pubmed/36903755 http://dx.doi.org/10.3390/nano13050878 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Li, Yaqiang
Zhou, Hongyu
Wu, Chunjing
Yin, Zheng
Liu, Chang
Liu, Junyou
Shi, Zhongliang
Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique
title Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique
title_full Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique
title_fullStr Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique
title_full_unstemmed Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique
title_short Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique
title_sort interfacial characterization and thermal conductivity of diamond/cu composites prepared by liquid-solid separation technique
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10005683/
https://www.ncbi.nlm.nih.gov/pubmed/36903755
http://dx.doi.org/10.3390/nano13050878
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