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Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique

Diamond/Cu composites are widely studied as a new generation of thermal management materials in the field of electronic packaging and heat sink materials. The surface modification of diamond can improve interfacial bonding between the diamond and Cu matrix. The Ti-coated diamond/Cu composites are pr...

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Detalles Bibliográficos
Autores principales:	Li, Yaqiang, Zhou, Hongyu, Wu, Chunjing, Yin, Zheng, Liu, Chang, Liu, Junyou, Shi, Zhongliang
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2023
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10005683/ https://www.ncbi.nlm.nih.gov/pubmed/36903755 http://dx.doi.org/10.3390/nano13050878

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