Copolymerization of Parylene C and Parylene F to Enhance Adhesion and Thermal Stability without Coating Performance Degradation

Parylene C has been widely used in the fields of microelectromechanical systems (MEMS) and electronic device encapsulation because of its unique properties, such as biocompatibility and conformal coverage. However, its poor adhesion and low thermal stability limit its use in a wider range of applica...

Descripción completa

Detalles Bibliográficos
Autores principales: Xu, Han, Yang, Zhou, Guo, Yechang, Xu, Qingmei, Dou, Songtao, Zhang, Pan, Jin, Yufeng, Kang, Jiajie, Wang, Wei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10007139/
https://www.ncbi.nlm.nih.gov/pubmed/36904490
http://dx.doi.org/10.3390/polym15051249

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10007139/
https://www.ncbi.nlm.nih.gov/pubmed/36904490
http://dx.doi.org/10.3390/polym15051249

Ejemplares similares