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Copolymerization of Parylene C and Parylene F to Enhance Adhesion and Thermal Stability without Coating Performance Degradation
Parylene C has been widely used in the fields of microelectromechanical systems (MEMS) and electronic device encapsulation because of its unique properties, such as biocompatibility and conformal coverage. However, its poor adhesion and low thermal stability limit its use in a wider range of applica...
Autores principales: | Xu, Han, Yang, Zhou, Guo, Yechang, Xu, Qingmei, Dou, Songtao, Zhang, Pan, Jin, Yufeng, Kang, Jiajie, Wang, Wei |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10007139/ https://www.ncbi.nlm.nih.gov/pubmed/36904490 http://dx.doi.org/10.3390/polym15051249 |
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