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Wafer Type Ion Energy Monitoring Sensor for Plasma Diagnosis

We propose a wafer-type ion energy monitoring sensor (IEMS) that can measure the spatially resolved distribution of ion energy over the 150 mm plasma chamber for the in situ monitoring of the semiconductor fabrication process. The IEMS can directly be applied to the semiconductor chip production equ...

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Detalles Bibliográficos
Autores principales: Han, Chansu, Koo, Yoonsung, Kim, Jaehwan, Choi, Kwangwook, Hong, Sangjeen
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10007180/
https://www.ncbi.nlm.nih.gov/pubmed/36904613
http://dx.doi.org/10.3390/s23052410
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author Han, Chansu
Koo, Yoonsung
Kim, Jaehwan
Choi, Kwangwook
Hong, Sangjeen
author_facet Han, Chansu
Koo, Yoonsung
Kim, Jaehwan
Choi, Kwangwook
Hong, Sangjeen
author_sort Han, Chansu
collection PubMed
description We propose a wafer-type ion energy monitoring sensor (IEMS) that can measure the spatially resolved distribution of ion energy over the 150 mm plasma chamber for the in situ monitoring of the semiconductor fabrication process. The IEMS can directly be applied to the semiconductor chip production equipment without further modification of the automated wafer handling system. Thus, it can be adopted as an in situ data acquisition platform for plasma characterization inside the process chamber. To achieve ion energy measurement on the wafer-type sensor, the injected ion flux energy from the plasma sheath was converted into the induced currents on each electrode over the wafer-type sensor, and the generated currents from the ion injection were compared along the position of electrodes. The IEMS operates without problems in the plasma environment and has the same trends as the result predicted through the equation.
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spelling pubmed-100071802023-03-12 Wafer Type Ion Energy Monitoring Sensor for Plasma Diagnosis Han, Chansu Koo, Yoonsung Kim, Jaehwan Choi, Kwangwook Hong, Sangjeen Sensors (Basel) Communication We propose a wafer-type ion energy monitoring sensor (IEMS) that can measure the spatially resolved distribution of ion energy over the 150 mm plasma chamber for the in situ monitoring of the semiconductor fabrication process. The IEMS can directly be applied to the semiconductor chip production equipment without further modification of the automated wafer handling system. Thus, it can be adopted as an in situ data acquisition platform for plasma characterization inside the process chamber. To achieve ion energy measurement on the wafer-type sensor, the injected ion flux energy from the plasma sheath was converted into the induced currents on each electrode over the wafer-type sensor, and the generated currents from the ion injection were compared along the position of electrodes. The IEMS operates without problems in the plasma environment and has the same trends as the result predicted through the equation. MDPI 2023-02-22 /pmc/articles/PMC10007180/ /pubmed/36904613 http://dx.doi.org/10.3390/s23052410 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Communication
Han, Chansu
Koo, Yoonsung
Kim, Jaehwan
Choi, Kwangwook
Hong, Sangjeen
Wafer Type Ion Energy Monitoring Sensor for Plasma Diagnosis
title Wafer Type Ion Energy Monitoring Sensor for Plasma Diagnosis
title_full Wafer Type Ion Energy Monitoring Sensor for Plasma Diagnosis
title_fullStr Wafer Type Ion Energy Monitoring Sensor for Plasma Diagnosis
title_full_unstemmed Wafer Type Ion Energy Monitoring Sensor for Plasma Diagnosis
title_short Wafer Type Ion Energy Monitoring Sensor for Plasma Diagnosis
title_sort wafer type ion energy monitoring sensor for plasma diagnosis
topic Communication
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10007180/
https://www.ncbi.nlm.nih.gov/pubmed/36904613
http://dx.doi.org/10.3390/s23052410
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