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A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance
Because of high conductivity, acceptable cost and good screen-printing process performance, silver pastes have been extensively used for making flexible electronics. However, there are few reported articles focusing on high heat resistance solidified silver pastes and their rheological properties. I...
Autores principales: | , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10007458/ https://www.ncbi.nlm.nih.gov/pubmed/36904391 http://dx.doi.org/10.3390/polym15051150 |
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author | Wang, Zhenhe Wang, Dong Zhang, Chunbo Chen, Wei Meng, Qingjie Yuan, Hang Yang, Shiyong |
author_facet | Wang, Zhenhe Wang, Dong Zhang, Chunbo Chen, Wei Meng, Qingjie Yuan, Hang Yang, Shiyong |
author_sort | Wang, Zhenhe |
collection | PubMed |
description | Because of high conductivity, acceptable cost and good screen-printing process performance, silver pastes have been extensively used for making flexible electronics. However, there are few reported articles focusing on high heat resistance solidified silver pastes and their rheological properties. In this paper, a fluorinated polyamic acids (FPAA) is synthesized by polymerization of the 4,4′-(hexafluoroisopropylidene) diphthalic anhydride and 3,4′-diaminodiphenylether as monomers in the diethylene glycol monobutyl. The nano silver pastes are prepared by mixing the obtained FPAA resin with nano silver powder. The agglomerated particles caused by nano silver powder are divided and the dispersion of nano silver pastes are improved by three-roll grinding process with low roll gaps. The obtained nano silver pastes possess excellent thermal resistance with 5% weight loss temperature higher than 500 °C. The volume resistivity of cured nano silver paste achieves 4.52 × 10(−7) Ω·m, when the silver content is 83% and the curing temperature is 300 °C. Additionally, the nano silver pastes have high thixotropic performance, which contributes to fabricate the fine pattern with high resolution. Finally, the conductive pattern with high resolution is prepared by printing silver nano pastes onto PI (Kapton-H) film. The excellent comprehensive properties, including good electrical conductivity, outstanding heat resistance and high thixotropy, make it a potential application in flexible electronics manufacturing, especially in high-temperature fields. |
format | Online Article Text |
id | pubmed-10007458 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2023 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-100074582023-03-12 A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance Wang, Zhenhe Wang, Dong Zhang, Chunbo Chen, Wei Meng, Qingjie Yuan, Hang Yang, Shiyong Polymers (Basel) Article Because of high conductivity, acceptable cost and good screen-printing process performance, silver pastes have been extensively used for making flexible electronics. However, there are few reported articles focusing on high heat resistance solidified silver pastes and their rheological properties. In this paper, a fluorinated polyamic acids (FPAA) is synthesized by polymerization of the 4,4′-(hexafluoroisopropylidene) diphthalic anhydride and 3,4′-diaminodiphenylether as monomers in the diethylene glycol monobutyl. The nano silver pastes are prepared by mixing the obtained FPAA resin with nano silver powder. The agglomerated particles caused by nano silver powder are divided and the dispersion of nano silver pastes are improved by three-roll grinding process with low roll gaps. The obtained nano silver pastes possess excellent thermal resistance with 5% weight loss temperature higher than 500 °C. The volume resistivity of cured nano silver paste achieves 4.52 × 10(−7) Ω·m, when the silver content is 83% and the curing temperature is 300 °C. Additionally, the nano silver pastes have high thixotropic performance, which contributes to fabricate the fine pattern with high resolution. Finally, the conductive pattern with high resolution is prepared by printing silver nano pastes onto PI (Kapton-H) film. The excellent comprehensive properties, including good electrical conductivity, outstanding heat resistance and high thixotropy, make it a potential application in flexible electronics manufacturing, especially in high-temperature fields. MDPI 2023-02-24 /pmc/articles/PMC10007458/ /pubmed/36904391 http://dx.doi.org/10.3390/polym15051150 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Wang, Zhenhe Wang, Dong Zhang, Chunbo Chen, Wei Meng, Qingjie Yuan, Hang Yang, Shiyong A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance |
title | A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance |
title_full | A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance |
title_fullStr | A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance |
title_full_unstemmed | A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance |
title_short | A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance |
title_sort | fluorinated polyimide based nano silver paste with high thermal resistance and outstanding thixotropic performance |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10007458/ https://www.ncbi.nlm.nih.gov/pubmed/36904391 http://dx.doi.org/10.3390/polym15051150 |
work_keys_str_mv | AT wangzhenhe afluorinatedpolyimidebasednanosilverpastewithhighthermalresistanceandoutstandingthixotropicperformance AT wangdong afluorinatedpolyimidebasednanosilverpastewithhighthermalresistanceandoutstandingthixotropicperformance AT zhangchunbo afluorinatedpolyimidebasednanosilverpastewithhighthermalresistanceandoutstandingthixotropicperformance AT chenwei afluorinatedpolyimidebasednanosilverpastewithhighthermalresistanceandoutstandingthixotropicperformance AT mengqingjie afluorinatedpolyimidebasednanosilverpastewithhighthermalresistanceandoutstandingthixotropicperformance AT yuanhang afluorinatedpolyimidebasednanosilverpastewithhighthermalresistanceandoutstandingthixotropicperformance AT yangshiyong afluorinatedpolyimidebasednanosilverpastewithhighthermalresistanceandoutstandingthixotropicperformance AT wangzhenhe fluorinatedpolyimidebasednanosilverpastewithhighthermalresistanceandoutstandingthixotropicperformance AT wangdong fluorinatedpolyimidebasednanosilverpastewithhighthermalresistanceandoutstandingthixotropicperformance AT zhangchunbo fluorinatedpolyimidebasednanosilverpastewithhighthermalresistanceandoutstandingthixotropicperformance AT chenwei fluorinatedpolyimidebasednanosilverpastewithhighthermalresistanceandoutstandingthixotropicperformance AT mengqingjie fluorinatedpolyimidebasednanosilverpastewithhighthermalresistanceandoutstandingthixotropicperformance AT yuanhang fluorinatedpolyimidebasednanosilverpastewithhighthermalresistanceandoutstandingthixotropicperformance AT yangshiyong fluorinatedpolyimidebasednanosilverpastewithhighthermalresistanceandoutstandingthixotropicperformance |