3D Graphene-Nanowire “Sandwich” Thermal Interface with Ultralow Resistance and Stiffness

[Image: see text] Despite the recent advancements of passive and active cooling solutions for electronics, interfaces between materials have generally become crucial barriers for thermal transport because of intrinsic material dissimilarity and surface roughness at interfaces. We demonstrate a 3D gr...

Descripción completa

Detalles Bibliográficos
Autores principales: Jing, Lin, Cheng, Rui, Garg, Raghav, Gong, Wei, Lee, Inkyu, Schmit, Aaron, Cohen-Karni, Tzahi, Zhang, Xu, Shen, Sheng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2023
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10041630/
https://www.ncbi.nlm.nih.gov/pubmed/36649646
http://dx.doi.org/10.1021/acsnano.2c10525

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10041630/
https://www.ncbi.nlm.nih.gov/pubmed/36649646
http://dx.doi.org/10.1021/acsnano.2c10525

Ejemplares similares