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3D Graphene-Nanowire “Sandwich” Thermal Interface with Ultralow Resistance and Stiffness
[Image: see text] Despite the recent advancements of passive and active cooling solutions for electronics, interfaces between materials have generally become crucial barriers for thermal transport because of intrinsic material dissimilarity and surface roughness at interfaces. We demonstrate a 3D gr...
| Autores principales: | , , , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
American Chemical Society
2023
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10041630/ https://www.ncbi.nlm.nih.gov/pubmed/36649646 http://dx.doi.org/10.1021/acsnano.2c10525 |