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Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere

This study proposes a low-temperature transient liquid phase bonding (TLPB) method using Sn58Bi/porous Cu/Sn58Bi to enable efficient power-device packaging at high temperatures. The bonding mechanism is attributed to the rapid reaction between porous Cu and Sn58Bi solder, leading to the formation of...

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Detalles Bibliográficos
Autores principales:	He, Siliang, Xiong, Bifu, Xu, Fangyi, Chen, Biyang, Cui, Yinhua, Hu, Chuan, Yue, Gao, Shen, Yu-An
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2023
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10051379/ https://www.ncbi.nlm.nih.gov/pubmed/36984269 http://dx.doi.org/10.3390/ma16062389

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