Design and Synthesis of Functional Silane-Based Silicone Resin and Application in Low-Temperature Curing Silver Conductive Inks

In the field of flexible electronics manufacturing, inkjet printing technology is a research hotspot, and it is key to developing low-temperature curing conductive inks that meet printing requirements and have suitable functions. Herein, methylphenylamino silicon oil (N75) and epoxy-modified silicon oil (SE35) were successfully synthesized through functional silicon monomers, and they were used to prepare silicone resin 1030H with nano SiO(2). 1030H silicone resin was used as the resin binder for silver conductive ink. The silver conductive ink we prepared with 1030H has good dispersion performance with a particle size of 50–100 nm, as well as good storage stability and excellent adhesion. Additionally, the printing performance and conductivity of the silver conductive ink prepared with n,n-dimethylformamide (DMF): proprylene glycol monomethyl ether (PM) (1:1) as solvent are better than those of the silver conductive ink prepared by DMF and PM solvent. Cured at a low temperature of 160 °C, the resistivity of 1030H-Ag-82%-3 conductive ink is 6.87 × 10(−6) Ω·m, and that of 1030H-Ag-92%-3 conductive ink is 0.564 × 10(−6) Ω·m, so the low-temperature curing silver conductive ink has high conductivity. The low-temperature curing silver conductive ink we prepared meets the printing requirements and has potential for practical applications.