Effects of Voids on Thermal Fatigue Reliability of Solder Joints on Inner Rings in Ball Grid Array Packaging by Finite Element Analysis

Under alternating temperatures, the fatigue failure of solder balls caused by the mismatch of the thermal expansion coefficient is a key problem in a Ball Grid Array (BGA). However, the combined effects of the solder ball location and the size of voids within it can seriously affect the thermal fati...

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Detalles Bibliográficos
Autores principales: Hu, Xingwang, Liu, Li, Liu, Sheng, Ruan, Meng, Chen, Zhiwen
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10055788/
https://www.ncbi.nlm.nih.gov/pubmed/36984994
http://dx.doi.org/10.3390/mi14030588

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10055788/
https://www.ncbi.nlm.nih.gov/pubmed/36984994
http://dx.doi.org/10.3390/mi14030588

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