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Synthesis of KH550-Modified Hexagonal Boron Nitride Nanofillers for Improving Thermal Conductivity of Epoxy Nanocomposites

In this work, KH550 (γ-aminopropyl triethoxy silane)-modified hexagonal boron nitride (BN) nanofillers were synthesized through a one-step ball-milling route. Results show that the KH550-modified BN nanofillers synthesized by one-step ball-milling (BM@KH550-BN) exhibit excellent dispersion stability...

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Autores principales: Tang, Bolin, Cao, Miao, Yang, Yaru, Guan, Jipeng, Yao, Yongbo, Yi, Jie, Dong, Jun, Wang, Tianle, Wang, Luxiang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10058683/
https://www.ncbi.nlm.nih.gov/pubmed/36987196
http://dx.doi.org/10.3390/polym15061415
_version_ 1785016692633501696
author Tang, Bolin
Cao, Miao
Yang, Yaru
Guan, Jipeng
Yao, Yongbo
Yi, Jie
Dong, Jun
Wang, Tianle
Wang, Luxiang
author_facet Tang, Bolin
Cao, Miao
Yang, Yaru
Guan, Jipeng
Yao, Yongbo
Yi, Jie
Dong, Jun
Wang, Tianle
Wang, Luxiang
author_sort Tang, Bolin
collection PubMed
description In this work, KH550 (γ-aminopropyl triethoxy silane)-modified hexagonal boron nitride (BN) nanofillers were synthesized through a one-step ball-milling route. Results show that the KH550-modified BN nanofillers synthesized by one-step ball-milling (BM@KH550-BN) exhibit excellent dispersion stability and a high yield of BN nanosheets. Using BM@KH550-BN as fillers for epoxy resin, the thermal conductivity of epoxy nanocomposites increased by 195.7% at 10 wt%, compared to neat epoxy resin. Simultaneously, the storage modulus and glass transition temperature (Tg) of the BM@KH550-BN/epoxy nanocomposite at 10 wt% also increased by 35.6% and 12.4 °C, respectively. The data calculated from the dynamical mechanical analysis show that the BM@KH550-BN nanofillers have a better filler effectiveness and a higher volume fraction of constrained region. The morphology of the fracture surface of the epoxy nanocomposites indicate that the BM@KH550-BN presents a uniform distribution in the epoxy matrix even at 10 wt%. This work guides the convenient preparation of high thermally conductive BN nanofillers, presenting a great application potential in the field of thermally conductive epoxy nanocomposites, which will promote the development of electronic packaging materials.
format Online
Article
Text
id pubmed-10058683
institution National Center for Biotechnology Information
language English
publishDate 2023
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-100586832023-03-30 Synthesis of KH550-Modified Hexagonal Boron Nitride Nanofillers for Improving Thermal Conductivity of Epoxy Nanocomposites Tang, Bolin Cao, Miao Yang, Yaru Guan, Jipeng Yao, Yongbo Yi, Jie Dong, Jun Wang, Tianle Wang, Luxiang Polymers (Basel) Article In this work, KH550 (γ-aminopropyl triethoxy silane)-modified hexagonal boron nitride (BN) nanofillers were synthesized through a one-step ball-milling route. Results show that the KH550-modified BN nanofillers synthesized by one-step ball-milling (BM@KH550-BN) exhibit excellent dispersion stability and a high yield of BN nanosheets. Using BM@KH550-BN as fillers for epoxy resin, the thermal conductivity of epoxy nanocomposites increased by 195.7% at 10 wt%, compared to neat epoxy resin. Simultaneously, the storage modulus and glass transition temperature (Tg) of the BM@KH550-BN/epoxy nanocomposite at 10 wt% also increased by 35.6% and 12.4 °C, respectively. The data calculated from the dynamical mechanical analysis show that the BM@KH550-BN nanofillers have a better filler effectiveness and a higher volume fraction of constrained region. The morphology of the fracture surface of the epoxy nanocomposites indicate that the BM@KH550-BN presents a uniform distribution in the epoxy matrix even at 10 wt%. This work guides the convenient preparation of high thermally conductive BN nanofillers, presenting a great application potential in the field of thermally conductive epoxy nanocomposites, which will promote the development of electronic packaging materials. MDPI 2023-03-13 /pmc/articles/PMC10058683/ /pubmed/36987196 http://dx.doi.org/10.3390/polym15061415 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Tang, Bolin
Cao, Miao
Yang, Yaru
Guan, Jipeng
Yao, Yongbo
Yi, Jie
Dong, Jun
Wang, Tianle
Wang, Luxiang
Synthesis of KH550-Modified Hexagonal Boron Nitride Nanofillers for Improving Thermal Conductivity of Epoxy Nanocomposites
title Synthesis of KH550-Modified Hexagonal Boron Nitride Nanofillers for Improving Thermal Conductivity of Epoxy Nanocomposites
title_full Synthesis of KH550-Modified Hexagonal Boron Nitride Nanofillers for Improving Thermal Conductivity of Epoxy Nanocomposites
title_fullStr Synthesis of KH550-Modified Hexagonal Boron Nitride Nanofillers for Improving Thermal Conductivity of Epoxy Nanocomposites
title_full_unstemmed Synthesis of KH550-Modified Hexagonal Boron Nitride Nanofillers for Improving Thermal Conductivity of Epoxy Nanocomposites
title_short Synthesis of KH550-Modified Hexagonal Boron Nitride Nanofillers for Improving Thermal Conductivity of Epoxy Nanocomposites
title_sort synthesis of kh550-modified hexagonal boron nitride nanofillers for improving thermal conductivity of epoxy nanocomposites
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10058683/
https://www.ncbi.nlm.nih.gov/pubmed/36987196
http://dx.doi.org/10.3390/polym15061415
work_keys_str_mv AT tangbolin synthesisofkh550modifiedhexagonalboronnitridenanofillersforimprovingthermalconductivityofepoxynanocomposites
AT caomiao synthesisofkh550modifiedhexagonalboronnitridenanofillersforimprovingthermalconductivityofepoxynanocomposites
AT yangyaru synthesisofkh550modifiedhexagonalboronnitridenanofillersforimprovingthermalconductivityofepoxynanocomposites
AT guanjipeng synthesisofkh550modifiedhexagonalboronnitridenanofillersforimprovingthermalconductivityofepoxynanocomposites
AT yaoyongbo synthesisofkh550modifiedhexagonalboronnitridenanofillersforimprovingthermalconductivityofepoxynanocomposites
AT yijie synthesisofkh550modifiedhexagonalboronnitridenanofillersforimprovingthermalconductivityofepoxynanocomposites
AT dongjun synthesisofkh550modifiedhexagonalboronnitridenanofillersforimprovingthermalconductivityofepoxynanocomposites
AT wangtianle synthesisofkh550modifiedhexagonalboronnitridenanofillersforimprovingthermalconductivityofepoxynanocomposites
AT wangluxiang synthesisofkh550modifiedhexagonalboronnitridenanofillersforimprovingthermalconductivityofepoxynanocomposites