Miniaturized On-Ground 2.4 GHz IoT LTCC Chip Antenna and Its Positioning on a Ground Plane

This paper presents a very low-profile on-ground chip antenna with a total volume of 0.075 [Formula: see text] × 0.056 [Formula: see text] × 0.019 [Formula: see text] (at f [Formula: see text] = 2.4 GHz). The proposed design is a corrugated (accordion-like) planar inverted F antenna (PIFA) embedded in low-loss glass ceramic material (DuPont GreenTape 9k7 with [Formula: see text] = 7.1 and [Formula: see text] = 0.0009) fabricated with LTCC technology. The antenna does not require a clearance area on the ground plane where the antenna is located, and it is proposed for 2.4 GHz IoT applications for extreme size-limited devices. It shows a 25 MHz impedance bandwidth (for S [Formula: see text] < −6 dB), which means a relative bandwidth of [Formula: see text]). A study in terms of matching and total efficiency is performed for several size ground planes with the antenna installed at different positions. The use of characteristic modes analysis (CMA) and the correlation between modal and total radiated fields is performed to demonstrate the optimum position of the antenna. Results show high-frequency stability and a total efficiency difference of up to 5.3 dB if the antenna is not placed at the optimum position.