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π-Shape ESD Protection Design for Multi-Gbps High-Speed Circuits in CMOS Technology

CMOS integrated circuits are vulnerable to electrostatic discharge (ESD); therefore, ESD protection circuits are needed. On-chip ESD protection is important for both component-level and system-level ESD protection. In this work, on-chip ESD protection circuits for multi-Gbps high-speed applications...

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Autores principales: Chang, Chun-Rong, Dai, Zih-Jyun, Lin, Chun-Yu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10095089/
https://www.ncbi.nlm.nih.gov/pubmed/37048855
http://dx.doi.org/10.3390/ma16072562
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author Chang, Chun-Rong
Dai, Zih-Jyun
Lin, Chun-Yu
author_facet Chang, Chun-Rong
Dai, Zih-Jyun
Lin, Chun-Yu
author_sort Chang, Chun-Rong
collection PubMed
description CMOS integrated circuits are vulnerable to electrostatic discharge (ESD); therefore, ESD protection circuits are needed. On-chip ESD protection is important for both component-level and system-level ESD protection. In this work, on-chip ESD protection circuits for multi-Gbps high-speed applications are studied. π-shaped ESD protection circuit structures realized by staked diodes with an embedded silicon-controlled rectifier (SCR) and resistor-triggered SCR are proposed. These test circuits are fabricated in CMOS technology, and the proposed designs have been proven to have better ESD robustness and performance in high-speed applications.
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spelling pubmed-100950892023-04-13 π-Shape ESD Protection Design for Multi-Gbps High-Speed Circuits in CMOS Technology Chang, Chun-Rong Dai, Zih-Jyun Lin, Chun-Yu Materials (Basel) Article CMOS integrated circuits are vulnerable to electrostatic discharge (ESD); therefore, ESD protection circuits are needed. On-chip ESD protection is important for both component-level and system-level ESD protection. In this work, on-chip ESD protection circuits for multi-Gbps high-speed applications are studied. π-shaped ESD protection circuit structures realized by staked diodes with an embedded silicon-controlled rectifier (SCR) and resistor-triggered SCR are proposed. These test circuits are fabricated in CMOS technology, and the proposed designs have been proven to have better ESD robustness and performance in high-speed applications. MDPI 2023-03-23 /pmc/articles/PMC10095089/ /pubmed/37048855 http://dx.doi.org/10.3390/ma16072562 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Chang, Chun-Rong
Dai, Zih-Jyun
Lin, Chun-Yu
π-Shape ESD Protection Design for Multi-Gbps High-Speed Circuits in CMOS Technology
title π-Shape ESD Protection Design for Multi-Gbps High-Speed Circuits in CMOS Technology
title_full π-Shape ESD Protection Design for Multi-Gbps High-Speed Circuits in CMOS Technology
title_fullStr π-Shape ESD Protection Design for Multi-Gbps High-Speed Circuits in CMOS Technology
title_full_unstemmed π-Shape ESD Protection Design for Multi-Gbps High-Speed Circuits in CMOS Technology
title_short π-Shape ESD Protection Design for Multi-Gbps High-Speed Circuits in CMOS Technology
title_sort π-shape esd protection design for multi-gbps high-speed circuits in cmos technology
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10095089/
https://www.ncbi.nlm.nih.gov/pubmed/37048855
http://dx.doi.org/10.3390/ma16072562
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