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T-ray Wavelength Decoupled Imaging and Profile Mapping of a Whole Wafer for Die Sorting and Analysis
This paper describes a terahertz (T-ray) cameraless imaging and profile mapping technique for accomplishing the imaging and/or mapping of a whole wafer with fabricated dies for devising a criterion to sort out good dies. A stratagem for decoupling the wavelength’s dependence on image formation is de...
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2023
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10098755/ https://www.ncbi.nlm.nih.gov/pubmed/37050723 http://dx.doi.org/10.3390/s23073663 |