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Different weathering conditions affect the release of microplastics by masks

A generation of microplastics caused by improper disposal of disposable masks has become a non-negligible environmental concern. In order to investigate the degradation mechanisms of masks and the release of microplastics under different environmental conditions, the masks are placed in 4 common env...

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Detalles Bibliográficos
Autores principales: Zhang, Ting, Zhao, Changrong, Chen, Xi, Jiang, Angrui, You, Zhaoyang, Shah, Kinjal J.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer Berlin Heidelberg 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10127988/
https://www.ncbi.nlm.nih.gov/pubmed/37097580
http://dx.doi.org/10.1007/s11356-023-27116-9
Descripción
Sumario:A generation of microplastics caused by improper disposal of disposable masks has become a non-negligible environmental concern. In order to investigate the degradation mechanisms of masks and the release of microplastics under different environmental conditions, the masks are placed in 4 common environments. After 30 days of weathering, the total amount and release kinetics of microplastics released from different layers of the mask were studied. The chemical and mechanical properties of the mask were also discussed. The results showed that the mask released 25141±3543 particles/mask into the soil, which is much more than the sea and river water. The release kinetics of microplastics fit the Elovich model better. All samples correspond to the release rate of microplastics from fast to slow. Experiments show that the middle layer of the mask is released more than the other layers, and the amount of release was highest in the soil. And the tensile capacity of the mask is negatively correlated with its ability to release microplastics in the following order, which are soil > seawater > river > air > new masks. In addition, during the weathering process, the C-C/C-H bond of the mask was broken. SUPPLEMENTARY INFORMATION: The online version contains supplementary material available at 10.1007/s11356-023-27116-9.