Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation

The integration of assembled foils in injection-molded parts is a challenging step. Such assembled foils typically comprise a plastic foil on which a circuit board is printed and electronic components are mounted. Those components can detach during overmolding when high pressures and shear stresses...

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Detalles Bibliográficos
Autores principales: Hubmann, Martin, Bakr, Mona, Groten, Jonas, Pletz, Martin, Vanfleteren, Jan, Bossuyt, Frederick, Madadnia, Behnam, Stadlober, Barbara
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10141065/
https://www.ncbi.nlm.nih.gov/pubmed/37421110
http://dx.doi.org/10.3390/mi14040876

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