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Interplay between copper redox and transfer and support acidity and topology in low temperature NH(3)-SCR

Low-temperature standard NH(3)-SCR over copper-exchanged zeolite catalysts occurs on NH(3)-solvated Cu-ion active sites in a quasi-homogeneous manner. As key kinetically relevant reaction steps, the reaction intermediate Cu(II)(NH(3))(4) ion hydrolyzes to Cu(II)(OH)(NH(3))(3) ion to gain redox activ...

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Detalles Bibliográficos
Autores principales: Wu, Yiqing, Zhao, Wenru, Ahn, Sang Hyun, Wang, Yilin, Walter, Eric D., Chen, Ying, Derewinski, Miroslaw A., Washton, Nancy M., Rappé, Kenneth G., Wang, Yong, Mei, Donghai, Hong, Suk Bong, Gao, Feng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10164144/
https://www.ncbi.nlm.nih.gov/pubmed/37149681
http://dx.doi.org/10.1038/s41467-023-38309-8
Descripción
Sumario:Low-temperature standard NH(3)-SCR over copper-exchanged zeolite catalysts occurs on NH(3)-solvated Cu-ion active sites in a quasi-homogeneous manner. As key kinetically relevant reaction steps, the reaction intermediate Cu(II)(NH(3))(4) ion hydrolyzes to Cu(II)(OH)(NH(3))(3) ion to gain redox activity. The Cu(II)(OH)(NH(3))(3) ion also transfers between neighboring zeolite cages to form highly reactive reaction intermediates. Via operando electron paramagnetic resonance spectroscopy and SCR kinetic measurements and density functional theory calculations, we demonstrate here that such kinetically relevant steps become energetically more difficult with lower support Brønsted acid strength and density. Consequently, Cu/LTA displays lower Cu atomic efficiency than Cu/CHA and Cu/AEI, which can also be rationalized by considering differences in their support topology. By carrying out hydrothermal aging to eliminate support Brønsted acid sites, both Cu(II)(NH(3))(4) ion hydrolysis and Cu(II)(OH)(NH(3))(3) ion migration are hindered, leading to a marked decrease in Cu atomic efficiency for all catalysts.