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Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling
Eutectic In-48Sn was considered a promising candidate for low-temperature solder due to its low melting point and excellent mechanical properties. Both Cu(2)(In,Sn) and Cu(In,Sn)(2) formation were observed at the In-48Sn/Cu interface after 160 °C soldering. However, traditional mechanical polishing...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10179094/ https://www.ncbi.nlm.nih.gov/pubmed/37176172 http://dx.doi.org/10.3390/ma16093290 |