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High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation

In this study, thermal and argon (Ar) plasma/wetting treatments were combined to enhance the bonding strength of polyimide (PI) films. Attenuated total reflectance-Fourier transform infrared spectroscopy (ATR-FTIR) was used to analyze the changes in the PI imidization degrees. The contact angles of...

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Detalles Bibliográficos
Autores principales:	He, Pin-Syuan, Tran, Dinh-Phuc, Kuo, Ting-Yu, Hsu, Wei-You, Lin, Huai-En, Shie, Kai-Cheng, Chen, Chih
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2023
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10180403/ https://www.ncbi.nlm.nih.gov/pubmed/37177120 http://dx.doi.org/10.3390/nano13091575

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