Cargando…

Crosstalk Analysis of Delay-Insensitive Code in High-Speed Package Interconnects

The development of integrated circuits has increased the size of chip interconnects, which has brought challenges to interconnect design in chip packages. The closer the spacing between interconnects, the higher the space utilization, which can cause severe crosstalk problems in high-speed circuits....

Descripción completa

Detalles Bibliográficos
Autores principales: Sun, Bo, Xu, Zhaoxin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10222314/
https://www.ncbi.nlm.nih.gov/pubmed/37241656
http://dx.doi.org/10.3390/mi14051033
_version_ 1785049668166615040
author Sun, Bo
Xu, Zhaoxin
author_facet Sun, Bo
Xu, Zhaoxin
author_sort Sun, Bo
collection PubMed
description The development of integrated circuits has increased the size of chip interconnects, which has brought challenges to interconnect design in chip packages. The closer the spacing between interconnects, the higher the space utilization, which can cause severe crosstalk problems in high-speed circuits. In this paper, we applied delay-insensitive coding to the design of high-speed package interconnects. We also analyzed the effect of delay-insensitive coding on crosstalk improvement in package interconnects at 26 GHz for its high crosstalk immunity. Compared to the synchronous transmission circuit, the 1-of-2 and 1-of-4 encoded circuits designed in this paper can reduce crosstalk peaks by 22.9% and 17.5% on average at a wiring spacing of 1–7 μm, which can achieve closer wiring spacing.
format Online
Article
Text
id pubmed-10222314
institution National Center for Biotechnology Information
language English
publishDate 2023
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-102223142023-05-28 Crosstalk Analysis of Delay-Insensitive Code in High-Speed Package Interconnects Sun, Bo Xu, Zhaoxin Micromachines (Basel) Article The development of integrated circuits has increased the size of chip interconnects, which has brought challenges to interconnect design in chip packages. The closer the spacing between interconnects, the higher the space utilization, which can cause severe crosstalk problems in high-speed circuits. In this paper, we applied delay-insensitive coding to the design of high-speed package interconnects. We also analyzed the effect of delay-insensitive coding on crosstalk improvement in package interconnects at 26 GHz for its high crosstalk immunity. Compared to the synchronous transmission circuit, the 1-of-2 and 1-of-4 encoded circuits designed in this paper can reduce crosstalk peaks by 22.9% and 17.5% on average at a wiring spacing of 1–7 μm, which can achieve closer wiring spacing. MDPI 2023-05-11 /pmc/articles/PMC10222314/ /pubmed/37241656 http://dx.doi.org/10.3390/mi14051033 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Sun, Bo
Xu, Zhaoxin
Crosstalk Analysis of Delay-Insensitive Code in High-Speed Package Interconnects
title Crosstalk Analysis of Delay-Insensitive Code in High-Speed Package Interconnects
title_full Crosstalk Analysis of Delay-Insensitive Code in High-Speed Package Interconnects
title_fullStr Crosstalk Analysis of Delay-Insensitive Code in High-Speed Package Interconnects
title_full_unstemmed Crosstalk Analysis of Delay-Insensitive Code in High-Speed Package Interconnects
title_short Crosstalk Analysis of Delay-Insensitive Code in High-Speed Package Interconnects
title_sort crosstalk analysis of delay-insensitive code in high-speed package interconnects
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10222314/
https://www.ncbi.nlm.nih.gov/pubmed/37241656
http://dx.doi.org/10.3390/mi14051033
work_keys_str_mv AT sunbo crosstalkanalysisofdelayinsensitivecodeinhighspeedpackageinterconnects
AT xuzhaoxin crosstalkanalysisofdelayinsensitivecodeinhighspeedpackageinterconnects