Cargando…

Tailoring Food Biopolymers into Biogels for Regenerative Wound Healing and Versatile Skin Bioelectronics

An increasing utilization of wound-related therapeutic materials and skin bioelectronics urges the development of multifunctional biogels for personal therapy and health management. Nevertheless, conventional dressings and skin bioelectronics with single function, mechanical mismatches, and impracti...

Descripción completa

Detalles Bibliográficos
Autores principales: Zeng, Qiankun, Peng, Qiwen, Wang, Fangbing, Shi, Guoyue, Haick, Hossam, Zhang, Min
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer Nature Singapore 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10247910/
https://www.ncbi.nlm.nih.gov/pubmed/37286816
http://dx.doi.org/10.1007/s40820-023-01099-1
Descripción
Sumario:An increasing utilization of wound-related therapeutic materials and skin bioelectronics urges the development of multifunctional biogels for personal therapy and health management. Nevertheless, conventional dressings and skin bioelectronics with single function, mechanical mismatches, and impracticality severely limit their widespread applications in clinical. Herein, we explore a gelling mechanism, fabrication method, and functionalization for broadly applicable food biopolymers-based biogels that unite the challenging needs of elastic yet injectable wound dressing and skin bioelectronics in a single system. We combine our biogels with functional nanomaterials, such as cuttlefish ink nanoparticles and silver nanowires, to endow the biogels with reactive oxygen species scavenging capacity and electrical conductivity, and finally realized the improvement in diabetic wound microenvironment and the monitoring of electrophysiological signals on skin. This line of research work sheds light on preparing food biopolymers-based biogels with multifunctional integration of wound treatment and smart medical treatment. [Image: see text] SUPPLEMENTARY INFORMATION: The online version contains supplementary material available at 10.1007/s40820-023-01099-1.