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Ureido Hyperbranched Polymer Modified Urea-Formaldehyde Resin as High-Performance Particleboard Adhesive
The performance of urea-formaldehyde (UF) resin and its formaldehyde emission is a natural contradiction. High molar ratio UF resin performance is very good, but its formaldehyde release is high; low molar ratio UF resin formaldehyde release is reduced, but the resin itself performance becomes very...
Autores principales: | , , , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10254379/ https://www.ncbi.nlm.nih.gov/pubmed/37297155 http://dx.doi.org/10.3390/ma16114021 |
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author | Yang, Hongxing Wang, Hao Du, Guanben Ni, Kelu Wu, Yingchen Su, Hang Gao, Wei Tan, Xiaoping Yang, Zhaojin Yang, Long Ran, Xin |
author_facet | Yang, Hongxing Wang, Hao Du, Guanben Ni, Kelu Wu, Yingchen Su, Hang Gao, Wei Tan, Xiaoping Yang, Zhaojin Yang, Long Ran, Xin |
author_sort | Yang, Hongxing |
collection | PubMed |
description | The performance of urea-formaldehyde (UF) resin and its formaldehyde emission is a natural contradiction. High molar ratio UF resin performance is very good, but its formaldehyde release is high; low molar ratio UF resin formaldehyde release is reduced, but the resin itself performance becomes very bad. In order to solve this traditional problem, an excellent strategy of UF resin modified by hyperbranched polyurea is proposed. In this work, hyperbranched polyurea (UPA(6N)) is first synthesized by a simple method without any solvent. UPA(6N) is then added into industrial UF resin in different proportions as additives to manufacture particleboard and test its related properties. UF resin with a low molar ratio has a crystalline lamellar structure, and UF-UPA(6N) resin has an amorphous structure and rough surface. The results show that internal bonding strength increased by 58.5%, modulus of rupture increased by 24.4%, 24 h thickness swelling rate (%) decreased by 54.4%, and formaldehyde emission decreased by 34.6% compared with the unmodified UF particleboard. This may be ascribed to the polycondensation between UF and UPA(6N), while UF-UPA(6N) resin forms more dense three-dimensional network structures. Finally, the application of UF-UPA(6N) resin adhesives to bond particleboard significantly improves the adhesive strength and water resistance and reduces formaldehyde emission, suggesting that the adhesive can be used as a green and eco-friendly adhesive resource for the wood industry. |
format | Online Article Text |
id | pubmed-10254379 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2023 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-102543792023-06-10 Ureido Hyperbranched Polymer Modified Urea-Formaldehyde Resin as High-Performance Particleboard Adhesive Yang, Hongxing Wang, Hao Du, Guanben Ni, Kelu Wu, Yingchen Su, Hang Gao, Wei Tan, Xiaoping Yang, Zhaojin Yang, Long Ran, Xin Materials (Basel) Article The performance of urea-formaldehyde (UF) resin and its formaldehyde emission is a natural contradiction. High molar ratio UF resin performance is very good, but its formaldehyde release is high; low molar ratio UF resin formaldehyde release is reduced, but the resin itself performance becomes very bad. In order to solve this traditional problem, an excellent strategy of UF resin modified by hyperbranched polyurea is proposed. In this work, hyperbranched polyurea (UPA(6N)) is first synthesized by a simple method without any solvent. UPA(6N) is then added into industrial UF resin in different proportions as additives to manufacture particleboard and test its related properties. UF resin with a low molar ratio has a crystalline lamellar structure, and UF-UPA(6N) resin has an amorphous structure and rough surface. The results show that internal bonding strength increased by 58.5%, modulus of rupture increased by 24.4%, 24 h thickness swelling rate (%) decreased by 54.4%, and formaldehyde emission decreased by 34.6% compared with the unmodified UF particleboard. This may be ascribed to the polycondensation between UF and UPA(6N), while UF-UPA(6N) resin forms more dense three-dimensional network structures. Finally, the application of UF-UPA(6N) resin adhesives to bond particleboard significantly improves the adhesive strength and water resistance and reduces formaldehyde emission, suggesting that the adhesive can be used as a green and eco-friendly adhesive resource for the wood industry. MDPI 2023-05-27 /pmc/articles/PMC10254379/ /pubmed/37297155 http://dx.doi.org/10.3390/ma16114021 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Yang, Hongxing Wang, Hao Du, Guanben Ni, Kelu Wu, Yingchen Su, Hang Gao, Wei Tan, Xiaoping Yang, Zhaojin Yang, Long Ran, Xin Ureido Hyperbranched Polymer Modified Urea-Formaldehyde Resin as High-Performance Particleboard Adhesive |
title | Ureido Hyperbranched Polymer Modified Urea-Formaldehyde Resin as High-Performance Particleboard Adhesive |
title_full | Ureido Hyperbranched Polymer Modified Urea-Formaldehyde Resin as High-Performance Particleboard Adhesive |
title_fullStr | Ureido Hyperbranched Polymer Modified Urea-Formaldehyde Resin as High-Performance Particleboard Adhesive |
title_full_unstemmed | Ureido Hyperbranched Polymer Modified Urea-Formaldehyde Resin as High-Performance Particleboard Adhesive |
title_short | Ureido Hyperbranched Polymer Modified Urea-Formaldehyde Resin as High-Performance Particleboard Adhesive |
title_sort | ureido hyperbranched polymer modified urea-formaldehyde resin as high-performance particleboard adhesive |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10254379/ https://www.ncbi.nlm.nih.gov/pubmed/37297155 http://dx.doi.org/10.3390/ma16114021 |
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