A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, a...

Descripción completa

Detalles Bibliográficos
Autores principales: Wang, Haoyu, Ma, Jianshe, Yang, Yide, Gong, Mali, Wang, Qinheng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10301016/
https://www.ncbi.nlm.nih.gov/pubmed/37374734
http://dx.doi.org/10.3390/mi14061149
_version_ 1785064712767012864
author Wang, Haoyu
Ma, Jianshe
Yang, Yide
Gong, Mali
Wang, Qinheng
author_facet Wang, Haoyu
Ma, Jianshe
Yang, Yide
Gong, Mali
Wang, Qinheng
author_sort Wang, Haoyu
collection PubMed
description The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors—thermal management, mechanical stress and electrical properties—can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package.
format Online
Article
Text
id pubmed-10301016
institution National Center for Biotechnology Information
language English
publishDate 2023
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-103010162023-06-29 A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging Wang, Haoyu Ma, Jianshe Yang, Yide Gong, Mali Wang, Qinheng Micromachines (Basel) Review The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors—thermal management, mechanical stress and electrical properties—can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package. MDPI 2023-05-29 /pmc/articles/PMC10301016/ /pubmed/37374734 http://dx.doi.org/10.3390/mi14061149 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Review
Wang, Haoyu
Ma, Jianshe
Yang, Yide
Gong, Mali
Wang, Qinheng
A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging
title A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging
title_full A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging
title_fullStr A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging
title_full_unstemmed A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging
title_short A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging
title_sort review of system-in-package technologies: application and reliability of advanced packaging
topic Review
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10301016/
https://www.ncbi.nlm.nih.gov/pubmed/37374734
http://dx.doi.org/10.3390/mi14061149
work_keys_str_mv AT wanghaoyu areviewofsysteminpackagetechnologiesapplicationandreliabilityofadvancedpackaging
AT majianshe areviewofsysteminpackagetechnologiesapplicationandreliabilityofadvancedpackaging
AT yangyide areviewofsysteminpackagetechnologiesapplicationandreliabilityofadvancedpackaging
AT gongmali areviewofsysteminpackagetechnologiesapplicationandreliabilityofadvancedpackaging
AT wangqinheng areviewofsysteminpackagetechnologiesapplicationandreliabilityofadvancedpackaging
AT wanghaoyu reviewofsysteminpackagetechnologiesapplicationandreliabilityofadvancedpackaging
AT majianshe reviewofsysteminpackagetechnologiesapplicationandreliabilityofadvancedpackaging
AT yangyide reviewofsysteminpackagetechnologiesapplicationandreliabilityofadvancedpackaging
AT gongmali reviewofsysteminpackagetechnologiesapplicationandreliabilityofadvancedpackaging
AT wangqinheng reviewofsysteminpackagetechnologiesapplicationandreliabilityofadvancedpackaging

Ejemplares similares