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A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, a...

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Detalles Bibliográficos
Autores principales: Wang, Haoyu, Ma, Jianshe, Yang, Yide, Gong, Mali, Wang, Qinheng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10301016/
https://www.ncbi.nlm.nih.gov/pubmed/37374734
http://dx.doi.org/10.3390/mi14061149

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