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Crack-Based Sensor with Microstructures for Strain and Pressure Sensing

Recent extensive research on flexible electronics has led to the development of various flexible sensors. In particular, sensors inspired by the slit organs of a spider, which utilize cracks in a metal film to measure strain, have garnered considerable interest. This method exhibited significantly h...

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Autores principales: Kim, Nakung, Yun, Daegeun, Hwang, Injoo, Yoon, Gibaek, Kang, Seong Min, Choi, Yong Whan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10301158/
https://www.ncbi.nlm.nih.gov/pubmed/37420710
http://dx.doi.org/10.3390/s23125545
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author Kim, Nakung
Yun, Daegeun
Hwang, Injoo
Yoon, Gibaek
Kang, Seong Min
Choi, Yong Whan
author_facet Kim, Nakung
Yun, Daegeun
Hwang, Injoo
Yoon, Gibaek
Kang, Seong Min
Choi, Yong Whan
author_sort Kim, Nakung
collection PubMed
description Recent extensive research on flexible electronics has led to the development of various flexible sensors. In particular, sensors inspired by the slit organs of a spider, which utilize cracks in a metal film to measure strain, have garnered considerable interest. This method exhibited significantly high sensitivity, repeatability, and durability in measuring strain. In this study, a thin-film crack sensor was developed using a microstructure. The results exhibited its ability to simultaneously measure the tensile force and pressure in a thin film, further expanding its applications. Furthermore, the strain and pressure characteristics of the sensor were measured and analyzed using an FEM simulation. The proposed method is expected to contribute to the future development of wearable sensors and artificial electronic skin research.
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spelling pubmed-103011582023-06-29 Crack-Based Sensor with Microstructures for Strain and Pressure Sensing Kim, Nakung Yun, Daegeun Hwang, Injoo Yoon, Gibaek Kang, Seong Min Choi, Yong Whan Sensors (Basel) Article Recent extensive research on flexible electronics has led to the development of various flexible sensors. In particular, sensors inspired by the slit organs of a spider, which utilize cracks in a metal film to measure strain, have garnered considerable interest. This method exhibited significantly high sensitivity, repeatability, and durability in measuring strain. In this study, a thin-film crack sensor was developed using a microstructure. The results exhibited its ability to simultaneously measure the tensile force and pressure in a thin film, further expanding its applications. Furthermore, the strain and pressure characteristics of the sensor were measured and analyzed using an FEM simulation. The proposed method is expected to contribute to the future development of wearable sensors and artificial electronic skin research. MDPI 2023-06-13 /pmc/articles/PMC10301158/ /pubmed/37420710 http://dx.doi.org/10.3390/s23125545 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Kim, Nakung
Yun, Daegeun
Hwang, Injoo
Yoon, Gibaek
Kang, Seong Min
Choi, Yong Whan
Crack-Based Sensor with Microstructures for Strain and Pressure Sensing
title Crack-Based Sensor with Microstructures for Strain and Pressure Sensing
title_full Crack-Based Sensor with Microstructures for Strain and Pressure Sensing
title_fullStr Crack-Based Sensor with Microstructures for Strain and Pressure Sensing
title_full_unstemmed Crack-Based Sensor with Microstructures for Strain and Pressure Sensing
title_short Crack-Based Sensor with Microstructures for Strain and Pressure Sensing
title_sort crack-based sensor with microstructures for strain and pressure sensing
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10301158/
https://www.ncbi.nlm.nih.gov/pubmed/37420710
http://dx.doi.org/10.3390/s23125545
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AT kangseongmin crackbasedsensorwithmicrostructuresforstrainandpressuresensing
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