Fixed-Diamond Abrasive Wire-Saw Cutting Force Modeling Based on Changes in Contact Arc Lengths

Monocrystalline silicon is widely used in the semiconductor market, but its hard and brittle physical properties make processing difficult. Fixed-diamond abrasive wire-saw (FAW) cutting is currently the most commonly used cutting method for hard and brittle materials due to advantages such as narrow...

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Detalles Bibliográficos
Autores principales: Liang, Lie, Li, Shujuan, Lan, Kehao, Wang, Jiabin, Yu, Ruijiang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10301508/
https://www.ncbi.nlm.nih.gov/pubmed/37374860
http://dx.doi.org/10.3390/mi14061275

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10301508/
https://www.ncbi.nlm.nih.gov/pubmed/37374860
http://dx.doi.org/10.3390/mi14061275

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