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Fixed-Diamond Abrasive Wire-Saw Cutting Force Modeling Based on Changes in Contact Arc Lengths
Monocrystalline silicon is widely used in the semiconductor market, but its hard and brittle physical properties make processing difficult. Fixed-diamond abrasive wire-saw (FAW) cutting is currently the most commonly used cutting method for hard and brittle materials due to advantages such as narrow...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10301508/ https://www.ncbi.nlm.nih.gov/pubmed/37374860 http://dx.doi.org/10.3390/mi14061275 |