Analysis of the Influence of the Motion State of Ultra-Thin Sapphire Based on Layer-Stacked Clamping (LSC)

Ultra-thin sapphire wafer processing is receiving increasing attention in the LED substrate industry. In the cascade clamping method, the motion state of the wafer determines the uniformity of material removal, while the motion state of the wafer is related to its friction coefficient in the biplane...

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Detalles Bibliográficos
Autores principales: Chen, Zhixiang, Han, Shunkai, Feng, Ming, Zhang, Xianglei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10303554/
https://www.ncbi.nlm.nih.gov/pubmed/37374710
http://dx.doi.org/10.3390/mi14061124

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10303554/
https://www.ncbi.nlm.nih.gov/pubmed/37374710
http://dx.doi.org/10.3390/mi14061124

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