Cargando…
Analysis of the Influence of the Motion State of Ultra-Thin Sapphire Based on Layer-Stacked Clamping (LSC)
Ultra-thin sapphire wafer processing is receiving increasing attention in the LED substrate industry. In the cascade clamping method, the motion state of the wafer determines the uniformity of material removal, while the motion state of the wafer is related to its friction coefficient in the biplane...
Autores principales: | Chen, Zhixiang, Han, Shunkai, Feng, Ming, Zhang, Xianglei |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10303554/ https://www.ncbi.nlm.nih.gov/pubmed/37374710 http://dx.doi.org/10.3390/mi14061124 |
Ejemplares similares
-
The Mechanism of Layer Stacked Clamping (LSC) for Polishing Ultra-Thin Sapphire Wafer
por: Chen, Zhixiang, et al.
Publicado: (2020) -
The LSC welcomes new experiments
por: Ianni, Aldo
Publicado: (2015) -
Layer matching epitaxy of NiO thin films on atomically stepped sapphire (0001) substrates
por: Yamauchi, Ryosuke, et al.
Publicado: (2015) -
Empowering host immunity by kinase-targeting in LSC
por: Wang, Qian-Fei
Publicado: (2020) -
Ion Drift and Polarization in Thin SiO(2) and HfO(2) Layers Inserted in Silicon on Sapphire
por: Popov, Vladimir P., et al.
Publicado: (2022)