Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions

Flip Chip Ball Grid Array (FCBGA) packages, together with many other heterogeneous integration packages, are widely used in high I/O (Input/Output) density and high-performance computing applications. The thermal dissipation efficiency of such packages is often improved through the use of an externa...

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Detalles Bibliográficos
Autores principales: Shih, Meng-Kai, Liu, Yu-Hao, Lee, Calvin, Hung, C. P.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10304058/
https://www.ncbi.nlm.nih.gov/pubmed/37374473
http://dx.doi.org/10.3390/ma16124291

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10304058/
https://www.ncbi.nlm.nih.gov/pubmed/37374473
http://dx.doi.org/10.3390/ma16124291

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