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Thermal Deformation Behavior and Dynamic Softening Mechanisms of Zn-2.0Cu-0.15Ti Alloy: An Investigation of Hot Processing Conditions and Flow Stress Behavior
Through isothermal hot compression experiments at various strain rates and temperatures, the thermal deformation behavior of Zn-2.0Cu-0.15Ti alloy is investigated. The Arrhenius-type model is utilized to forecast flow stress behavior. Results show that the Arrhenius-type model accurately reflects th...
Autores principales: | , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10304457/ https://www.ncbi.nlm.nih.gov/pubmed/37374614 http://dx.doi.org/10.3390/ma16124431 |
Sumario: | Through isothermal hot compression experiments at various strain rates and temperatures, the thermal deformation behavior of Zn-2.0Cu-0.15Ti alloy is investigated. The Arrhenius-type model is utilized to forecast flow stress behavior. Results show that the Arrhenius-type model accurately reflects the flow behavior in the entire processing region. The dynamic material model (DMM) reveals that the optimal processing region for the hot processing of Zn-2.0Cu-0.15Ti alloy has a maximum efficiency of about 35%, in the temperatures range (493–543 K) and a strain rate range (0.01–0.1 s(−1)). Microstructure analysis demonstrates that the primary dynamic softening mechanism of Zn-2.0Cu-0.15Ti alloy after hot compression is significantly influenced by temperature and strain rate. At low temperature (423 K) and low strain rate (0.1 s(−1)), the interaction of dislocations is the primary mechanism for the softening Zn-2.0Cu-0.15Ti alloys. At a strain rate of 1 s(−1), the primary mechanism changes to continuous dynamic recrystallization (CDRX). Discontinuous dynamic recrystallization (DDRX) occurs when Zn-2.0Cu-0.15Ti alloy is deformed under the conditions of 523 K/0.1 s(−1), while twinning dynamic recrystallization (TDRX) and CDRX are observed when the strain rate is 10 s(−1). |
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