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Research of Vertical via Based on Silicon, Ceramic and Glass

With the increasing demand for high-density integration, low power consumption and high bandwidth, creating more sophisticated interconnection technologies is becoming increasingly crucial. Three-dimensional (3D) integration technology is known as the fourth-generation packaging technology beyond Mo...

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Detalles Bibliográficos
Autores principales: Tian, Wenchao, Wu, Sixian, Li, Wenhua
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10383172/
https://www.ncbi.nlm.nih.gov/pubmed/37512702
http://dx.doi.org/10.3390/mi14071391

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