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Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices

Silicon-based microchannel technology offers unmatched performance in the cooling of silicon pixel detectors in high-energy physics. Although Si–Si direct bonding, used for the fabrication of cooling plates, also meets the stringent requirements of this application (its high-pressure resistance of ~...

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Detalles Bibliográficos
Autores principales:	Bargiel, Sylwester, Cogan, Julien, Queste, Samuel, Oliveri, Stefania, Gauthier-Manuel, Ludovic, Raschetti, Marina, Leroy, Olivier, Beurthey, Stéphan, Perrin-Terrin, Mathieu
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2023
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10383613/ https://www.ncbi.nlm.nih.gov/pubmed/37512608 http://dx.doi.org/10.3390/mi14071297

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