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FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation
This paper presents a 3D direct numerical simulation of buckled thin-film packaging based on transferred elastic thin-film wrinkling bonded on a compliant polymer ring. The mode change of the fabricated thin-film cap is found by measuring the thin-film cap shape at different times after Si substrate...
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2023
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10383614/ https://www.ncbi.nlm.nih.gov/pubmed/37512623 http://dx.doi.org/10.3390/mi14071312 |