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Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration

Cu-Cu direct interconnects are highly desirable for the microelectronic industry as they allow for significant reductions in the size and spacing of microcontacts. The main challenge associated with using Cu is its tendency to rapidly oxidize in air. This research paper describes a method of Cu pass...

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Detalles Bibliográficos
Autores principales:	Lykova, Maria, Panchenko, Iuliana, Schneider-Ramelow, Martin, Suga, Tadatomo, Mu, Fengwen, Buschbeck, Roy
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2023
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10386150/ https://www.ncbi.nlm.nih.gov/pubmed/37512675 http://dx.doi.org/10.3390/mi14071365

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