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Effect of Solder Layer Void Damage on the Temperature of IGBT Modules

Solder layer void is one of the main failure causes of power semiconductor devices, which will seriously affect the reliability of the devices. In this study, a 3D model of IGBT (Insulated Gate Bipolar Transistor) packaging was built by DesignModeler. Based on ANSYS Workbench, the influence of void...

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Detalles Bibliográficos
Autores principales:	Xu, Pengpeng, Liu, Peisheng, Yan, Lei, Zhang, Zhao
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2023
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10386478/ https://www.ncbi.nlm.nih.gov/pubmed/37512655 http://dx.doi.org/10.3390/mi14071344

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