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Improved Through-Plane Thermal Conductivity of Poly(dimethylsiloxane)Composites through the Formation of 3D Filler Foam Using Freeze-Casting and Annealing Processes

The configuration of a continuous and oriented thermal pathway is essential for efficient heat dissipation in the oriented direction. Three-dimensional (3D) conductive filler structures provide a suitable approach for constructing continuous thermal pathways in polymer-based composites. The aluminum...

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Autores principales: Lee, Jooyoung, Yang, Wonyoung, Lee, Geunhyeong, Cho, Youngsung, Kim, Jooheon
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10421339/
https://www.ncbi.nlm.nih.gov/pubmed/37570472
http://dx.doi.org/10.3390/nano13152154
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author Lee, Jooyoung
Yang, Wonyoung
Lee, Geunhyeong
Cho, Youngsung
Kim, Jooheon
author_facet Lee, Jooyoung
Yang, Wonyoung
Lee, Geunhyeong
Cho, Youngsung
Kim, Jooheon
author_sort Lee, Jooyoung
collection PubMed
description The configuration of a continuous and oriented thermal pathway is essential for efficient heat dissipation in the oriented direction. Three-dimensional (3D) conductive filler structures provide a suitable approach for constructing continuous thermal pathways in polymer-based composites. The aluminum nitride/reduced graphene oxide/poly(dimethylsiloxane) (AlN/rGO/PDMS) composite material is made with a 3D foam structure and focuses on reducing GO and forming foam via polyvinyl alcohol (PVA). We analyze the successful fabrication of hybrid fillers and composites using various methods. The fabricated composite with a 3D network filler foam achieves a through-plane thermal conductivity of 1.43 W/mK and achieves 752% higher thermal conductivity compared to pure PDMS, which is superior to composites without 3D foam. The continuous 3D filler structure via freeze-drying and annealing processes provides efficient thermal dissipation in the through-plane direction pathway, which is critical for enhancing thermal conductivity. Therefore, this work produces a polymer composite material with improved thermal conductivity through various processes.
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spelling pubmed-104213392023-08-12 Improved Through-Plane Thermal Conductivity of Poly(dimethylsiloxane)Composites through the Formation of 3D Filler Foam Using Freeze-Casting and Annealing Processes Lee, Jooyoung Yang, Wonyoung Lee, Geunhyeong Cho, Youngsung Kim, Jooheon Nanomaterials (Basel) Article The configuration of a continuous and oriented thermal pathway is essential for efficient heat dissipation in the oriented direction. Three-dimensional (3D) conductive filler structures provide a suitable approach for constructing continuous thermal pathways in polymer-based composites. The aluminum nitride/reduced graphene oxide/poly(dimethylsiloxane) (AlN/rGO/PDMS) composite material is made with a 3D foam structure and focuses on reducing GO and forming foam via polyvinyl alcohol (PVA). We analyze the successful fabrication of hybrid fillers and composites using various methods. The fabricated composite with a 3D network filler foam achieves a through-plane thermal conductivity of 1.43 W/mK and achieves 752% higher thermal conductivity compared to pure PDMS, which is superior to composites without 3D foam. The continuous 3D filler structure via freeze-drying and annealing processes provides efficient thermal dissipation in the through-plane direction pathway, which is critical for enhancing thermal conductivity. Therefore, this work produces a polymer composite material with improved thermal conductivity through various processes. MDPI 2023-07-25 /pmc/articles/PMC10421339/ /pubmed/37570472 http://dx.doi.org/10.3390/nano13152154 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Lee, Jooyoung
Yang, Wonyoung
Lee, Geunhyeong
Cho, Youngsung
Kim, Jooheon
Improved Through-Plane Thermal Conductivity of Poly(dimethylsiloxane)Composites through the Formation of 3D Filler Foam Using Freeze-Casting and Annealing Processes
title Improved Through-Plane Thermal Conductivity of Poly(dimethylsiloxane)Composites through the Formation of 3D Filler Foam Using Freeze-Casting and Annealing Processes
title_full Improved Through-Plane Thermal Conductivity of Poly(dimethylsiloxane)Composites through the Formation of 3D Filler Foam Using Freeze-Casting and Annealing Processes
title_fullStr Improved Through-Plane Thermal Conductivity of Poly(dimethylsiloxane)Composites through the Formation of 3D Filler Foam Using Freeze-Casting and Annealing Processes
title_full_unstemmed Improved Through-Plane Thermal Conductivity of Poly(dimethylsiloxane)Composites through the Formation of 3D Filler Foam Using Freeze-Casting and Annealing Processes
title_short Improved Through-Plane Thermal Conductivity of Poly(dimethylsiloxane)Composites through the Formation of 3D Filler Foam Using Freeze-Casting and Annealing Processes
title_sort improved through-plane thermal conductivity of poly(dimethylsiloxane)composites through the formation of 3d filler foam using freeze-casting and annealing processes
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10421339/
https://www.ncbi.nlm.nih.gov/pubmed/37570472
http://dx.doi.org/10.3390/nano13152154
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