Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

The multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with a glass interposer to accomplish a competitive low fabrication cost compared with the silicon-based int...

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Detalles Bibliográficos
Autores principales: Wang, Shih-Hung, Hsu, Wensyang, Liou, Yan-Yu, Huang, Pei-Chen, Lee, Chang-Chun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456845/
https://www.ncbi.nlm.nih.gov/pubmed/37630042
http://dx.doi.org/10.3390/mi14081506

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456845/
https://www.ncbi.nlm.nih.gov/pubmed/37630042
http://dx.doi.org/10.3390/mi14081506

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