Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging

Wire-bonding technology is the most commonly used chip interconnection technology in microelectronic packaging. Metal bonding wire is the key material for wire bonding and plays an important role in the reliability of electronic devices. In recent years, palladium-plated copper (PdCu) bonding wire h...

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Detalles Bibliográficos
Autores principales: Zhang, Yuemin, Guo, Haiyun, Cao, Jun, Wu, Xuefeng, Jia, Hewei, Chang, Andong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456959/
https://www.ncbi.nlm.nih.gov/pubmed/37630074
http://dx.doi.org/10.3390/mi14081538

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456959/
https://www.ncbi.nlm.nih.gov/pubmed/37630074
http://dx.doi.org/10.3390/mi14081538

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