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Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging
Wire-bonding technology is the most commonly used chip interconnection technology in microelectronic packaging. Metal bonding wire is the key material for wire bonding and plays an important role in the reliability of electronic devices. In recent years, palladium-plated copper (PdCu) bonding wire h...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456959/ https://www.ncbi.nlm.nih.gov/pubmed/37630074 http://dx.doi.org/10.3390/mi14081538 |