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Piezoelectric Wafer Active Sensor Transducers for Acoustic Emission Applications

Piezoelectric materials are defined by their ability to display a charge across their surface in response to mechanical strain, making them great for use in sensing applications. Such applications include pressure sensors, medical devices, energy harvesting and structural health monitoring (SHM). SH...

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Detalles Bibliográficos
Autores principales: Griffin, Connor, Giurgiutiu, Victor
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10457745/
https://www.ncbi.nlm.nih.gov/pubmed/37631639
http://dx.doi.org/10.3390/s23167103
_version_ 1785096998262669312
author Griffin, Connor
Giurgiutiu, Victor
author_facet Griffin, Connor
Giurgiutiu, Victor
author_sort Griffin, Connor
collection PubMed
description Piezoelectric materials are defined by their ability to display a charge across their surface in response to mechanical strain, making them great for use in sensing applications. Such applications include pressure sensors, medical devices, energy harvesting and structural health monitoring (SHM). SHM describes the process of using a systematic approach to identify damage in engineering infrastructure. A method of SHM that uses piezoelectric wafers connected directly to the structure has become increasingly popular. An investigation of a novel pitch-catch method of determining instrumentation quality of piezoelectric wafer active sensors (PWASs) used in SHM was conducted as well as an investigation into the effects of defects in piezoelectric sensors and sensor bonding on the sensor response. This pitch-catch method was able to verify defect-less instrumentation quality of pristinely bonded PWASs. Additionally, the pitch-catch method was compared with the electromechanical impedance method in determining defects in piezoelectric sensor instrumentation. Using the pitch-catch method, it was found that defective instrumentation resulted in decreasing amplitude of received and transmitted signals as well as changes in the frequency spectrums of the signals, such as the elimination of high frequency peaks in those with defects in the bonding layer and an increased amplitude of around 600 kHz for a broken PWAS. The electromechanical impedance method concluded that bonding layer defects increase the primary frequency peak’s amplitude and cause a downward frequency shift in both the primary and secondary frequency peaks in the impedance spectrum, while a broken sensor has the primary peak amplitude reduced while shifting upward and nearly eliminating the secondary peak.
format Online
Article
Text
id pubmed-10457745
institution National Center for Biotechnology Information
language English
publishDate 2023
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-104577452023-08-27 Piezoelectric Wafer Active Sensor Transducers for Acoustic Emission Applications Griffin, Connor Giurgiutiu, Victor Sensors (Basel) Article Piezoelectric materials are defined by their ability to display a charge across their surface in response to mechanical strain, making them great for use in sensing applications. Such applications include pressure sensors, medical devices, energy harvesting and structural health monitoring (SHM). SHM describes the process of using a systematic approach to identify damage in engineering infrastructure. A method of SHM that uses piezoelectric wafers connected directly to the structure has become increasingly popular. An investigation of a novel pitch-catch method of determining instrumentation quality of piezoelectric wafer active sensors (PWASs) used in SHM was conducted as well as an investigation into the effects of defects in piezoelectric sensors and sensor bonding on the sensor response. This pitch-catch method was able to verify defect-less instrumentation quality of pristinely bonded PWASs. Additionally, the pitch-catch method was compared with the electromechanical impedance method in determining defects in piezoelectric sensor instrumentation. Using the pitch-catch method, it was found that defective instrumentation resulted in decreasing amplitude of received and transmitted signals as well as changes in the frequency spectrums of the signals, such as the elimination of high frequency peaks in those with defects in the bonding layer and an increased amplitude of around 600 kHz for a broken PWAS. The electromechanical impedance method concluded that bonding layer defects increase the primary frequency peak’s amplitude and cause a downward frequency shift in both the primary and secondary frequency peaks in the impedance spectrum, while a broken sensor has the primary peak amplitude reduced while shifting upward and nearly eliminating the secondary peak. MDPI 2023-08-11 /pmc/articles/PMC10457745/ /pubmed/37631639 http://dx.doi.org/10.3390/s23167103 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Griffin, Connor
Giurgiutiu, Victor
Piezoelectric Wafer Active Sensor Transducers for Acoustic Emission Applications
title Piezoelectric Wafer Active Sensor Transducers for Acoustic Emission Applications
title_full Piezoelectric Wafer Active Sensor Transducers for Acoustic Emission Applications
title_fullStr Piezoelectric Wafer Active Sensor Transducers for Acoustic Emission Applications
title_full_unstemmed Piezoelectric Wafer Active Sensor Transducers for Acoustic Emission Applications
title_short Piezoelectric Wafer Active Sensor Transducers for Acoustic Emission Applications
title_sort piezoelectric wafer active sensor transducers for acoustic emission applications
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10457745/
https://www.ncbi.nlm.nih.gov/pubmed/37631639
http://dx.doi.org/10.3390/s23167103
work_keys_str_mv AT griffinconnor piezoelectricwaferactivesensortransducersforacousticemissionapplications
AT giurgiutiuvictor piezoelectricwaferactivesensortransducersforacousticemissionapplications