Cargando…
Controlling Shear Rate for Designable Thermal Conductivity in Direct Ink Printing of Polydimethylsiloxane/Boron Nitride Composites
Efficient heat dissipation is vital for advancing device integration and high-frequency performance. Three-dimensional printing, famous for its convenience and structural controllability, facilitates complex parts with high thermal conductivity. Despite this, few studies have considered the influenc...
Autores principales: | , , , , , , |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10459169/ https://www.ncbi.nlm.nih.gov/pubmed/37631546 http://dx.doi.org/10.3390/polym15163489 |
Sumario: | Efficient heat dissipation is vital for advancing device integration and high-frequency performance. Three-dimensional printing, famous for its convenience and structural controllability, facilitates complex parts with high thermal conductivity. Despite this, few studies have considered the influence of shear rate on the thermal conductivity of printed parts. Herein, polydimethylsiloxane/boron nitride (PDMS/BN) composites were prepared and printed by direct ink writing (DIW). In order to ensure the smooth extrusion of the printing process and the structural stability of the part, a system with 40 wt% BN was selected according to the rheological properties. In addition, the effect of printing speed on the morphology of BN particles during 3D printing was studied by XRD, SEM observation, as well as ANSYS Polyflow simulation. The results demonstrated that increasing the printing speed from 10 mm/s to 120 mm/s altered the orientation angle of BN particles from 78.3° to 35.7°, promoting their alignment along the printing direction due to the high shear rate experienced. The resulting printed parts accordingly exhibited an impressive thermal conductivity of 0.849 W∙m(−1)∙K(−1), higher than the 0.454 W∙m(−1)∙K(−1) of the control sample. This study provides valuable insights and an important reference for future developments in the fabrication of thermal management devices with customizable thermal conductivity. |
---|