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Controlling Shear Rate for Designable Thermal Conductivity in Direct Ink Printing of Polydimethylsiloxane/Boron Nitride Composites

Efficient heat dissipation is vital for advancing device integration and high-frequency performance. Three-dimensional printing, famous for its convenience and structural controllability, facilitates complex parts with high thermal conductivity. Despite this, few studies have considered the influenc...

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Autores principales: Xiao, Bing, Zheng, Xinmei, Zhao, Yang, Huang, Bingxue, He, Pan, Peng, Biyou, Chen, Gang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10459169/
https://www.ncbi.nlm.nih.gov/pubmed/37631546
http://dx.doi.org/10.3390/polym15163489
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author Xiao, Bing
Zheng, Xinmei
Zhao, Yang
Huang, Bingxue
He, Pan
Peng, Biyou
Chen, Gang
author_facet Xiao, Bing
Zheng, Xinmei
Zhao, Yang
Huang, Bingxue
He, Pan
Peng, Biyou
Chen, Gang
author_sort Xiao, Bing
collection PubMed
description Efficient heat dissipation is vital for advancing device integration and high-frequency performance. Three-dimensional printing, famous for its convenience and structural controllability, facilitates complex parts with high thermal conductivity. Despite this, few studies have considered the influence of shear rate on the thermal conductivity of printed parts. Herein, polydimethylsiloxane/boron nitride (PDMS/BN) composites were prepared and printed by direct ink writing (DIW). In order to ensure the smooth extrusion of the printing process and the structural stability of the part, a system with 40 wt% BN was selected according to the rheological properties. In addition, the effect of printing speed on the morphology of BN particles during 3D printing was studied by XRD, SEM observation, as well as ANSYS Polyflow simulation. The results demonstrated that increasing the printing speed from 10 mm/s to 120 mm/s altered the orientation angle of BN particles from 78.3° to 35.7°, promoting their alignment along the printing direction due to the high shear rate experienced. The resulting printed parts accordingly exhibited an impressive thermal conductivity of 0.849 W∙m(−1)∙K(−1), higher than the 0.454 W∙m(−1)∙K(−1) of the control sample. This study provides valuable insights and an important reference for future developments in the fabrication of thermal management devices with customizable thermal conductivity.
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spelling pubmed-104591692023-08-27 Controlling Shear Rate for Designable Thermal Conductivity in Direct Ink Printing of Polydimethylsiloxane/Boron Nitride Composites Xiao, Bing Zheng, Xinmei Zhao, Yang Huang, Bingxue He, Pan Peng, Biyou Chen, Gang Polymers (Basel) Article Efficient heat dissipation is vital for advancing device integration and high-frequency performance. Three-dimensional printing, famous for its convenience and structural controllability, facilitates complex parts with high thermal conductivity. Despite this, few studies have considered the influence of shear rate on the thermal conductivity of printed parts. Herein, polydimethylsiloxane/boron nitride (PDMS/BN) composites were prepared and printed by direct ink writing (DIW). In order to ensure the smooth extrusion of the printing process and the structural stability of the part, a system with 40 wt% BN was selected according to the rheological properties. In addition, the effect of printing speed on the morphology of BN particles during 3D printing was studied by XRD, SEM observation, as well as ANSYS Polyflow simulation. The results demonstrated that increasing the printing speed from 10 mm/s to 120 mm/s altered the orientation angle of BN particles from 78.3° to 35.7°, promoting their alignment along the printing direction due to the high shear rate experienced. The resulting printed parts accordingly exhibited an impressive thermal conductivity of 0.849 W∙m(−1)∙K(−1), higher than the 0.454 W∙m(−1)∙K(−1) of the control sample. This study provides valuable insights and an important reference for future developments in the fabrication of thermal management devices with customizable thermal conductivity. MDPI 2023-08-21 /pmc/articles/PMC10459169/ /pubmed/37631546 http://dx.doi.org/10.3390/polym15163489 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Xiao, Bing
Zheng, Xinmei
Zhao, Yang
Huang, Bingxue
He, Pan
Peng, Biyou
Chen, Gang
Controlling Shear Rate for Designable Thermal Conductivity in Direct Ink Printing of Polydimethylsiloxane/Boron Nitride Composites
title Controlling Shear Rate for Designable Thermal Conductivity in Direct Ink Printing of Polydimethylsiloxane/Boron Nitride Composites
title_full Controlling Shear Rate for Designable Thermal Conductivity in Direct Ink Printing of Polydimethylsiloxane/Boron Nitride Composites
title_fullStr Controlling Shear Rate for Designable Thermal Conductivity in Direct Ink Printing of Polydimethylsiloxane/Boron Nitride Composites
title_full_unstemmed Controlling Shear Rate for Designable Thermal Conductivity in Direct Ink Printing of Polydimethylsiloxane/Boron Nitride Composites
title_short Controlling Shear Rate for Designable Thermal Conductivity in Direct Ink Printing of Polydimethylsiloxane/Boron Nitride Composites
title_sort controlling shear rate for designable thermal conductivity in direct ink printing of polydimethylsiloxane/boron nitride composites
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10459169/
https://www.ncbi.nlm.nih.gov/pubmed/37631546
http://dx.doi.org/10.3390/polym15163489
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