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Non-graphitized carbon/Cu(2)O/Cu(0) nanohybrids with improved stability and enhanced photocatalytic H(2) production
Cu(2)O is a highly potent photocatalyst, however photocorrosion stands as a key obstacle for its stability in photocatalytic technologies. Herein, we show that nanohybrids of Cu(2)O/Cu(0) nanoparticles interfaced with non-graphitized carbon (nGC) constitute a novel synthesis route towards stable Cu-...
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group UK
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10460407/ https://www.ncbi.nlm.nih.gov/pubmed/37634030 http://dx.doi.org/10.1038/s41598-023-41211-4 |
Sumario: | Cu(2)O is a highly potent photocatalyst, however photocorrosion stands as a key obstacle for its stability in photocatalytic technologies. Herein, we show that nanohybrids of Cu(2)O/Cu(0) nanoparticles interfaced with non-graphitized carbon (nGC) constitute a novel synthesis route towards stable Cu-photocatalysts with minimized photocorrosion. Using a Flame Spray Pyrolysis (FSP) process that allows synthesis of anoxic-Cu phases, we have developed in one-step a library of Cu(2)O/Cu(0) nanocatalysts interfaced with nGC, optimized for enhanced photocatalytic H(2) production from H(2)O. Co-optimization of the nGC and the Cu(2)O/Cu(0) ratio is shown to be a key strategy for high H(2) production, > 4700 μmoles g(−1) h(−1) plus enhanced stability against photocorrosion, and onset potential of 0.234 V vs. RHE. After 4 repetitive reuses the catalyst is shown to lose less than 5% of its photocatalytic efficiency, while photocorrosion was < 6%. In contrast, interfacing of Cu(2)O/Cu(0) with graphitized-C is not as efficient. Raman, FT-IR and TGA data are analyzed to explain the undelaying structural functional mechanisms where the tight interfacing of nGC with the Cu(2)O/Cu(0) nanophases is the preferred configuration. The present findings can be useful for wider technological goals that demand low-cost engineering, high stability Cu-nanodevices, prepared with industrially scalable process. |
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