Direct adhesion between Cu foil and polytetrafluoroethylene without increasing surface roughness for high-frequency printed wiring boards

Polytetrafluoroethylene (PTFE) serves as a suitable dielectric substrate for high-frequency printed wiring boards (PWBs) owing to its excellent properties at high frequency. However, to the best of our knowledge, no study has investigated the strong adhesion between PTFE and Cu foil with low surface...

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Detalles Bibliográficos
Autores principales: Nishino, Misa, Kodama, Takumi, Yamamura, Kazuya, Ohkubo, Yuji
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2023
Materias:
Chemistry
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10466178/
https://www.ncbi.nlm.nih.gov/pubmed/37655358
http://dx.doi.org/10.1039/d3ra03839d

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10466178/
https://www.ncbi.nlm.nih.gov/pubmed/37655358
http://dx.doi.org/10.1039/d3ra03839d

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