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Direct adhesion between Cu foil and polytetrafluoroethylene without increasing surface roughness for high-frequency printed wiring boards
Polytetrafluoroethylene (PTFE) serves as a suitable dielectric substrate for high-frequency printed wiring boards (PWBs) owing to its excellent properties at high frequency. However, to the best of our knowledge, no study has investigated the strong adhesion between PTFE and Cu foil with low surface...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
The Royal Society of Chemistry
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10466178/ https://www.ncbi.nlm.nih.gov/pubmed/37655358 http://dx.doi.org/10.1039/d3ra03839d |