A Comprehensive Study on the Effect of Highly Thermally Conductive Fillers on Improving the Properties of SBR/BR-Filled Nano-Silicon Nitride

[Image: see text] The effect of silicon nitride (Si(3)N(4)) as a thermally conductive material on the mechanical, microstructural, and physical properties as well as kinetics of the curing reaction of styrene-butadiene rubber/butadiene rubber (SBR/BR) was investigated in this work. The results showed an improvement in tensile, hardness, and compression features of the composite due to the presence of Si(3)N(4). The properties were enhanced with the filler loading content; somehow, the composite including Si(3)N(4) = 6 parts per hundred (phr) had the most significant performance, an increase of ∼15 and 20% in the maximum strain and toughness of the composite, respectively, an increase of almost 7% in the hardness, and an ∼13% reduction in the compression set. Also, the filler led to an increase in the crosslink density (calculated via the Flory–Rehner equation using swelling test) by 7.12 × 10(–5) mol/g, proving the increment of the covalent bonds between the polymer chains during the curing reaction. The kinetic consideration revealed a reduction in the scorch and optimum curing times by ∼40 and ∼25%, respectively. In order to describe the kinetics of curing reaction of SBR/BR-Si(3)N(4), an autocatalytic model based on the Kamal–Sourour model was applied on the rheometry results. The calculated kinetic parameters indicated that the thermally conductive Si(3)N(4) accelerated the curing reaction by ∼40%, particularly at Si(3)N(4) = 6 phr. After 6 phr of Si(3)N(4), agglomeration of the filler particles decreased its performance.