Grafting Amino Groups onto Polyimide Films in Flexible Copper-Clad Laminates Using Helicon Plasma

Polyimide (PI) films are widely used in electronic devices owing to their excellent mechanical and electrical properties and high thermal and chemical stabilities. In particular, PI films play an important role in flexible printed circuit boards (FPCBs). However, one challenge currently faced with t...

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Detalles Bibliográficos
Autores principales: Jin, Chenggang, Wang, Chen, Song, Shitao, Zhang, Yongqi, Wan, Jie, He, Liang, Qiao, Ziping, E, Peng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10532443/
https://www.ncbi.nlm.nih.gov/pubmed/37763491
http://dx.doi.org/10.3390/ma16186214

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10532443/
https://www.ncbi.nlm.nih.gov/pubmed/37763491
http://dx.doi.org/10.3390/ma16186214

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