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Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate

Indium is considered a candidate low-temperature solder because of its low melting temperature and excellent mechanical properties. However, the solid-state microstructure evolution of In with different substrates has rarely been studied due to the softness of In. To overcome this difficulty, cryoge...

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Detalles Bibliográficos
Autores principales:	Hung, Han-Tang, Chang, Fu-Ling, Tsai, Chin-Hao, Liao, Chia-Yi, Kao, C. R.
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2023
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10532517/ https://www.ncbi.nlm.nih.gov/pubmed/37763541 http://dx.doi.org/10.3390/ma16186263

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